Thermal Pad

Thermal pads are conformable thermal interface materials placed between heat-generating electronic components and heat sinks, housings, or other cooling surfaces. They help fill air gaps and surface irregularities so heat can transfer more efficiently away from components during operation.

T-Global USA is a leading manufacturer of advanced thermal management solutions, specializing in high-performance interface materials for global industrial applications. Our team works directly with designers to integrate effective thermal interface materials into complex hardware architectures. Learn more about heat transfer, our material options, and the diverse applications of thermal pads.

How Thermal Pads Support Heat Transfer in Electronics

Junction temperatures in electronic components and systems can increase when dissipation cannot keep pace with generation. Performance may decline when heat accumulates faster than it dissipates.

Thermal pads can be used to fill air gaps between chips and heat sinks. These conformable materials help create a heat path between heat sinks and electronic devices where uneven surface topography, air gaps, and texture preclude good thermal transfer. The conformable pad compresses into these spaces to establish solid metal-to-pad-to-metal contact, and heat moves from the junction through the pad and into the heat sink.

Types of Thermal Pads

T-Global offers different types of thermal pads with varying properties and applications.

Silicone-Based Thermal Pads

Our silicone thermal pad portfolio includes a wide range of thicknesses, sizes, and engineered formulations to meet diverse thermal management needs across electronic applications.

• High Thermal Conductivity and Good Compressibility. TG-A3500 requires minimal compressive force, making it well-suited for delicate components. TG-A6200 and TG-A1780 are optimized for high-power electronics, delivering efficient heat transfer in demanding applications such as power converters and RF amplifiers.
• Enhanced Mechanical Durability. TG-A20KX and TG-A38KX provide enhanced strength and resilience. These materials resist deformation under pressure, making them suitable for low- to medium-power systems where long-term structural integrity is critical.
• Low-Bleed Formulations. TG-A1800L, TG-A3200L, and TG-A5000L are engineered to minimize silicone oil migration under heat and pressure. This helps protect sensitive electronics from contamination, optical degradation, and potential short circuits, supporting long-term performance when validated in the final application.
• Ultra Soft and Low Thermal Impedance. TG-AD66 and TG-AD75 offer extremely low hardness for superior conformability and reduced thermal impedance. The newly launched TG-AD30D is certified to ASTM E595, making it suitable for aerospace and small satellite applications where low-outgassing performance is essential.
• Fiberglass Mesh Reinforcement. TG-A6200F and TG-A9000F provide excellent dimensional stability during assembly. In addition, they deliver higher dielectric breakdown voltage, supporting electrical insulation requirements in suitable designs in high-voltage environments.

At T-Global, we can also post-process materials into die-cut shapes or add adhesive backing.

Non-Silicone-Based Thermal Pads

At T-Global, we also provide non-silicone thermal pads to help address siloxane-outgassing concerns in sensitive components. Options like TG-APC93 and TG-APC94 deliver conductivity of 2.1 W/(m·K) and 4.2 W/(m·K) without silicone polymers. These thermal pads are offered in a range of different thicknesses and formats depending on the intended application.

Applications of Thermal Pads

Thermal pads from T-Global can be used in industrial equipment, aerospace electronics, renewable energy systems, and more.

Industrial Equipment

High-conductivity thermal pads can be used to move heat from semiconductor packages to chassis-mounted sinks. Reinforced grades can withstand vibration and thermal shock in factory environments.

Telecommunications Equipment

Thermal pads can bridge gaps between heat-generating components (ICs, amplifiers) and heat sinks in telecommunications equipment to support heat transfer, including in high-density, high-speed applications. Soft pads compress under minimal clamping force, which can help in designs with limited vertical space.

Automotive Electronics

Battery controllers, inverters, and DC-DC converters in EVs operate in wide temperature ranges, and materials must be able to endure thermal cycling, road vibration, and other factors. Suitable thermal pad types from T-Global include flexible silicone-based pads for uneven surfaces and non-silicone pads for use near optical modules or sensitive LED lighting.

Aerospace Electronics

A range of avionics applications rely on low-outgassing materials that may reduce contamination risk for sensitive instruments. T-Global’s non-silicone pads pass ASTM E595 outgassing limits while maintaining stable conductivity across altitude and temperature ranges.

Renewable Energy Systems

Solar inverters and battery systems are known to convert hundreds of watts while mounted in outdoor enclosures. IGBTs, MOSFETs, and diodes each present different interface challenges. At T-Global, we are able to provide pad formulations based on the geometry and heat flux density of the specific application.

Medical Tools and Equipment

Diagnostic imagers, surgical lasers, and LED-based instruments can generate concentrated heat in compact housings. In these applications, material selection depends on biocompatibility alongside thermal targets.

Thermal Simulation Support and Material Selection

T-Global’s simulation team models heat flow before you build physical prototypes, importing CAD files to analyze junction temperatures and thermal resistance paths. These results guide thickness and conductivity specifications. After the simulation defines targets, our engineers support thermal testing in fixtures to verify performance under load.

Contact T-Global for Thermal Pads

Thermal pads must compress into surface irregularities, survive operating environments, and maintain conductivity across service intervals. T-Global USA manufactures silicone thermal pads and non-silicone options with conductivity ratings and sizes to meet various thermal management needs. Our engineering team runs thermal simulations, recommends materials, and supports validation testing to match pad characteristics to your dissipation profile.

Request a quote or sample to address your cooling requirements.